These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

A new class of medium-voltage power modules has been introduced to support next-generation energy infrastructure, offering ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...