TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the high-margin work under its own roof. Now, for the first time, the world’s ...

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...

SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most ...

Google has ordered 3 million TPUs from Intel, and Nvidia is actively testing Intel’s 18A process technology, as both ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...